MCM63F737KZP8.5
vs
MT58L128L36FB-8.5
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRON TECHNOLOGY INC
Package Description
BGA,
14 X 22 MM, BGA-119
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
8.5 ns
8.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Length
22 mm
22 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
128KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
2.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
4
1
Rohs Code
No
Part Package Code
BGA
Pin Count
119
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.325 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare MCM63F737KZP8.5 with alternatives
Compare MT58L128L36FB-8.5 with alternatives