MCM63F737KZP8.5 vs MT58L128L36FB-8.5 feature comparison

MCM63F737KZP8.5 NXP Semiconductors

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MT58L128L36FB-8.5 Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICRON TECHNOLOGY INC
Package Description BGA, 14 X 22 MM, BGA-119
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8.5 ns 8.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 4 1
Rohs Code No
Part Package Code BGA
Pin Count 119
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.325 mA
Terminal Finish Tin/Lead (Sn/Pb)

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Compare MT58L128L36FB-8.5 with alternatives