MCM63R736FC4R
vs
AS7C331MNTD18A-133TQIN
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
BGA,
|
LQFP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
2 ns
|
3.8 ns
|
| JESD-30 Code |
R-PBGA-B119
|
R-PQFP-G100
|
| JESD-609 Code |
e0
|
e3
|
| Length |
22 mm
|
20 mm
|
| Memory Density |
4718592 bit
|
18874368 bit
|
| Memory IC Type |
LATE-WRITE SRAM
|
ZBT SRAM
|
| Memory Width |
36
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
119
|
100
|
| Number of Words |
131072 words
|
1048576 words
|
| Number of Words Code |
128000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
128KX36
|
1MX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LQFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.77 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
100
|
| Additional Feature |
|
PIPELINED ARCHITECTURE
|
|
|
|