MCM64PD32SG66
vs
SM364TCSMB3WI15
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
SMART MODULAR TECHNOLOGIES
|
Part Package Code |
CARD
|
DIMM
|
Package Description |
,
|
,
|
Pin Count |
160
|
160
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
8 ns
|
|
Additional Feature |
PIPELINED ARCHITECTURE
|
8K X 8 TAG
|
JESD-30 Code |
R-XDMA-N160
|
R-XDMA-N160
|
Memory Density |
2097152 bit
|
2097152 bit
|
Memory IC Type |
CACHE SRAM MODULE
|
CACHE TAG SRAM MODULE
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Terminals |
160
|
160
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
32KX64
|
32KX64
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.63 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
2.97 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCM64PD32SG66 with alternatives
Compare SM364TCSMB3WI15 with alternatives