MCM69R819AZP6 vs MT55V1MV18PT-6 feature comparison

MCM69R819AZP6 NXP Semiconductors

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MT55V1MV18PT-6 Micron Technology Inc

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MICRON TECHNOLOGY INC
Package Description BGA, PLASTIC, TQFP-100
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 3.5 ns
JESD-30 Code R-PBGA-B119 R-PQFP-G100
Length 22 mm 20 mm
Memory Density 4718592 bit 18874368 bit
Memory IC Type LATE-WRITE SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 2.4 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 2.625 V
Supply Voltage-Min (Vsup) 3.15 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 4 2
Rohs Code No
Part Package Code QFP
Pin Count 100
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Qualification Status Not Qualified
Standby Current-Max 0.03 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.25 mA
Terminal Finish Tin/Lead (Sn/Pb)

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Compare MT55V1MV18PT-6 with alternatives