MCP1700T-1802E/MAY
vs
MCP1700-1802E/MAY
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVSON, SOLCC6,.08,25
|
HVSON,
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Adjustability |
FIXED
|
|
Dropout Voltage1-Max |
0.35 V
|
0.35 V
|
Dropout Voltage1-Nom |
0.15 V
|
|
Input Voltage Absolute-Max |
6.5 V
|
|
Input Voltage-Max |
6 V
|
6 V
|
Input Voltage-Min |
2.8 V
|
2.3 V
|
JESD-30 Code |
R-PDSO-N6
|
S-PDSO-N6
|
JESD-609 Code |
e4
|
|
Length |
2 mm
|
2 mm
|
Line Regulation-Max |
0.0185%
|
|
Load Regulation-Max |
0.0278%
|
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
|
Number of Terminals |
6
|
6
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.25 A
|
0.2 A
|
Output Voltage1-Max |
1.854 V
|
1.836 V
|
Output Voltage1-Min |
1.746 V
|
1.764 V
|
Output Voltage1-Nom |
1.8 V
|
1.8 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC6,.08,25
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Qualification Status |
Not Qualified
|
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Tolerance-Max |
3%
|
2%
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MCP1700T-1802E/MAY with alternatives
Compare MCP1700-1802E/MAY with alternatives