MCP1755T-5002E/DB
vs
MCP1755TT-5002E/MC
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SOT-223, 4 PIN
|
DFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Dropout Voltage1-Max |
0.5 V
|
0.5 V
|
| Input Voltage-Max |
16 V
|
16 V
|
| Input Voltage-Min |
6 V
|
6 V
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
|
| Length |
6.5 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
8
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
5.1 V
|
5.1 V
|
| Output Voltage1-Min |
4.9 V
|
4.9 V
|
| Output Voltage1-Nom |
5 V
|
5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1.8 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
2.3 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tolerance-Max |
2%
|
2%
|
| Width |
3.5 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP1755T-5002E/DB with alternatives
Compare MCP1755TT-5002E/MC with alternatives