MCP2022T-330E/SL vs TJA1020U/V,029 feature comparison

MCP2022T-330E/SL Microchip Technology Inc

Buy Now Datasheet

TJA1020U/V,029 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description HSOP, DIE,
Pin Count 14
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-XUUC-N13
JESD-609 Code e3
Length 8.65 mm
Number of Functions 1 1
Number of Terminals 14 13
Number of Transceivers 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Screening Level TS 16949 AEC-Q100
Seated Height-Max 1.75 mm
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Telecom IC Type LIN TRANSCEIVER INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 3.9 mm
Base Number Matches 1 1
Manufacturer Package Code NAU000

Compare MCP2022T-330E/SL with alternatives

Compare TJA1020U/V,029 with alternatives