MCP23017-E/ML
vs
MCP23018-E/SSVAO
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
QFN
|
|
| Package Description |
Hvqccn, Lcc28,.24sq,25
|
Ssop, Ssop24,.3
|
| Pin Count |
28
|
24
|
| Manufacturer Package Code |
VQFN-28
|
SSOP-24
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
7 Weeks
|
| CPU Family |
Mcp23x17
|
|
| Clock Frequency-Max |
10 Mhz
|
10 Mhz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N28
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6 Mm
|
8.2 Mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
16
|
16
|
| Number of I/O Lines |
16
|
16
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HVQCCN
|
SSOP
|
| Package Equivalence Code |
LCC28,.24SQ,25
|
SSOP24,.3
|
| Package Shape |
Square
|
Rectangular
|
| Package Style |
Chip Carrier, Heat Sink/Slug, Very Thin Profile
|
Small Outline, Shrink Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 Mm
|
2 Mm
|
| Supply Current-Max |
1 Ma
|
1 Ma
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Automotive
|
Automotive
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
No Lead
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.65 Mm
|
| Terminal Position |
Quad
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
6 Mm
|
5.3 Mm
|
| uPs/uCs/Peripheral ICs Type |
Parallel Io Port, General Purpose
|
Parallel Io Port, General Purpose
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
Aec-Q100
|
|
|
|