MCP23018T-E/SP vs MCP23S17T-E/ML feature comparison

MCP23018T-E/SP Microchip Technology Inc

Buy Now Datasheet

MCP23S17T-E/ML Microchip Technology Inc

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP QFN
Package Description 0.300 INCH, LEAD FREE, PLASTIC, SDIP-28 QFN-28
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 10 MHz 10 MHz
External Data Bus Width
JESD-30 Code R-PDIP-T28 S-PQCC-N28
Length 34.671 mm 6 mm
Number of I/O Lines 16 16
Number of Ports 2 2
Number of Terminals 28 28
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 1.8 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL QUAD
Width 7.62 mm 6 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
CPU Family MCP23X17
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Bits 16
Package Equivalence Code LCC28,.24SQ,25
Peak Reflow Temperature (Cel) 260
Supply Current-Max 1 mA
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

Compare MCP23018T-E/SP with alternatives

Compare MCP23S17T-E/ML with alternatives