MCP23S09-E/MG vs MCP23008-E/P feature comparison

MCP23S09-E/MG Microchip Technology Inc

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MCP23008-E/P Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QFN DIP
Package Description HVQCCN, LCC16,.12SQ,20 DIP-18
Pin Count 16 18
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 4 Weeks
Samacsys Manufacturer Microchip Microchip
Clock Frequency-Max 10 MHz 10 MHz
External Data Bus Width
JESD-30 Code S-PQCC-N16 R-PDIP-T18
JESD-609 Code e3 e3
Length 3 mm 22.86 mm
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of I/O Lines 8 8
Number of Ports 1 8
Number of Terminals 16 18
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN DIP
Package Equivalence Code LCC16,.12SQ,20 DIP18,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.9 mm 5.08 mm
Supply Current-Max 1 mA 1 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 1.8 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3 mm 7.62 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 1

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