MCP2510T-I/P
vs
MCP2510-I/SOG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
Dip,
|
Sop,
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
No
|
No
|
| Clock Frequency-Max |
25 Mhz
|
25 Mhz
|
| Communication Protocol |
Mil Std 1553a; Mil Std 1553b
|
Sync, Byte
|
| Data Encoding/Decoding Method |
Nrz
|
Nrz
|
| Data Transfer Rate-Max |
0.125 Mbps
|
0.125 Mbps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDSO-G18
|
| JESD-609 Code |
e3
|
e3
|
| Length |
22.8 Mm
|
11.55 Mm
|
| Low Power Mode |
Yes
|
Yes
|
| Number of Serial I/Os |
2
|
1
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
In-Line
|
Small Outline
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.32 Mm
|
2.65 Mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
4.5 V
|
| Supply Voltage-Nom |
4.5 V
|
5 V
|
| Surface Mount |
No
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Matte Tin
|
Matte Tin
|
| Terminal Form |
Through-Hole
|
Gull Wing
|
| Terminal Pitch |
2.54 Mm
|
1.27 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Width |
7.62 Mm
|
7.5 Mm
|
| uPs/uCs/Peripheral ICs Type |
Serial Io/Communication Controller, Lan
|
Serial Io/Communication Controller, Lan
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
Operates At 3v Minimum Supply @ 16 Mhz
|
| Moisture Sensitivity Level |
|
1
|
|
|
|