MCP6144-E/P vs TSX634IPT feature comparison

MCP6144-E/P Microchip Technology Inc

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TSX634IPT STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code DIP
Package Description DIP, DIP14,.3 ROHS COMPLIANT, TSSOP-14
Pin Count 14
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Factory Lead Time 6 Weeks 18 Weeks
Samacsys Manufacturer Microchip STMicroelectronics
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA 0.0002 µA
Common-mode Reject Ratio-Min 62 dB
Common-mode Reject Ratio-Nom 80 dB 79 dB
Frequency Compensation YES
Input Offset Voltage-Max 3000 µV 2400 µV
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e3
Length 19.05 mm 5 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TUBE TR
Power NO
Programmable Power NO
Qualification Status Not Qualified
Seated Height-Max 5.334 mm 1.2 mm
Slew Rate-Nom 24000 V/us 0.12 V/us
Supply Current-Max 0.004 mA
Supply Voltage Limit-Max 7 V 18 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 100 200
Voltage Gain-Min 56200
Wideband NO
Width 7.62 mm 4.4 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MCP6144-E/P with alternatives

Compare TSX634IPT with alternatives