MCP6273-E/P
vs
MCP6271T-E/P
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP8,.3
|
,
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
6 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.005 µA
|
|
Common-mode Reject Ratio-Min |
65 dB
|
|
Common-mode Reject Ratio-Nom |
85 dB
|
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
5000 µV
|
|
JESD-30 Code |
R-PDIP-T8
|
|
JESD-609 Code |
e3
|
|
Length |
9.27 mm
|
|
Low-Bias |
YES
|
|
Low-Offset |
NO
|
|
Micropower |
YES
|
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Packing Method |
TUBE
|
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
5.334 mm
|
|
Slew Rate-Nom |
0.9 V/us
|
|
Supply Current-Max |
0.24 mA
|
|
Supply Voltage Limit-Max |
7 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Unity Gain BW-Nom |
2000
|
|
Voltage Gain-Min |
31620
|
|
Wideband |
NO
|
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6273-E/P with alternatives
Compare MCP6271T-E/P with alternatives