MCP6295T-E/P
vs
OPA2336P
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
DIP-8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Base Number Matches |
1
|
4
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
8
|
Samacsys Manufacturer |
|
Texas Instruments
|
Architecture |
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
|
0.00006 µA
|
Bias Current-Max (IIB) @25C |
|
0.00001 µA
|
Common-mode Reject Ratio-Min |
|
80 dB
|
Common-mode Reject Ratio-Nom |
|
90 dB
|
Frequency Compensation |
|
YES
|
Input Offset Current-Max (IIO) |
|
0.00001 µA
|
Input Offset Voltage-Max |
|
125 µV
|
JESD-30 Code |
|
R-PDIP-T8
|
JESD-609 Code |
|
e4
|
Length |
|
9.59 mm
|
Low-Bias |
|
YES
|
Low-Offset |
|
YES
|
Micropower |
|
YES
|
Number of Functions |
|
2
|
Number of Terminals |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP8,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Packing Method |
|
TUBE
|
Power |
|
NO
|
Programmable Power |
|
NO
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
5.08 mm
|
Slew Rate-Nom |
|
0.03 V/us
|
Supply Current-Max |
|
0.064 mA
|
Supply Voltage Limit-Max |
|
7.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Unity Gain BW-Nom |
|
100
|
Voltage Gain-Min |
|
31600
|
Wideband |
|
NO
|
Width |
|
7.62 mm
|
|
|
|
Compare MCP6295T-E/P with alternatives
Compare OPA2336P with alternatives