MCP655-E/ML
vs
MCP655-E/UN
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
MSOP
|
| Package Description |
HVQCCN,
|
TSSOP, TSSOP10,.19,20
|
| Pin Count |
16
|
10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.005 µA
|
0.005 µA
|
| Common-mode Reject Ratio-Nom |
81 dB
|
84 dB
|
| Input Offset Voltage-Max |
200 µV
|
200 µV
|
| JESD-30 Code |
S-PQCC-N16
|
S-PDSO-G10
|
| Length |
4 mm
|
3 mm
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Slew Rate-Nom |
30 V/us
|
30 V/us
|
| Supply Voltage Limit-Max |
6.5 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Unity Gain BW-Nom |
50000
|
50000
|
| Width |
4 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Min |
|
68 dB
|
| Frequency Compensation |
|
YES
|
| JESD-609 Code |
|
e3
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
YES
|
| Micropower |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
TSSOP10,.19,20
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
18 mA
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Voltage Gain-Min |
|
25118
|
| Wideband |
|
NO
|
|
|
|
Compare MCP655-E/ML with alternatives
Compare MCP655-E/UN with alternatives