MCP6L71T-E/OT
vs
MCP6273T-E/P
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOT-23
|
|
Package Description |
LSSOP, TSOP5/6,.11,37
|
,
|
Pin Count |
5
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
5 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Common-mode Reject Ratio-Nom |
91 dB
|
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
4000 µV
|
|
JESD-30 Code |
R-PDSO-G5
|
|
JESD-609 Code |
e3
|
|
Length |
2.9 mm
|
|
Low-Bias |
YES
|
|
Low-Offset |
NO
|
|
Micropower |
YES
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
|
Number of Terminals |
5
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LSOP
|
|
Package Equivalence Code |
TSOP5/6,.11,37
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, LOW PROFILE
|
|
Packing Method |
TAPE AND REEL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.45 mm
|
|
Slew Rate-Nom |
0.9 V/us
|
|
Supply Current-Max |
0.24 mA
|
|
Supply Voltage Limit-Max |
7 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.95 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Unity Gain BW-Nom |
2000
|
|
Wideband |
NO
|
|
Width |
1.55 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6L71T-E/OT with alternatives
Compare MCP6273T-E/P with alternatives