MCP6S21-I/MS
vs
MCP6S21-I/P
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
MSOP
|
DIP
|
Package Description |
PLASTIC, MSOP-8
|
0.300 INCH, PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
11 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
S-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
9.46 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
DIP
|
Package Equivalence Code |
TSSOP8,.19
|
DIP8,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1.18 mm
|
4.32 mm
|
Supply Current-Max (Isup) |
1.35 mA
|
1.35 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
4 V
|
4 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6S21-I/MS with alternatives
Compare MCP6S21-I/P with alternatives