MCP7940N-I/MNY
vs
MCP7940MT-I/MNY
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
|
| Package Description |
2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
|
2 X 3 MM, PLASTIC, TDFN-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| External Data Bus Width |
|
|
| Information Access Method |
SERIAL(I2C)
|
SERIAL(I2C)
|
| Interrupt Capability |
Y
|
Y
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Number of Terminals |
8
|
8
|
| Number of Timers |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.11,20
|
SOLCC8,.11,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time-Min |
SECONDS
|
SECONDS
|
| Volatile |
YES
|
YES
|
| Width |
2 mm
|
2 mm
|
| uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
7 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Moisture Sensitivity Level |
|
1
|
| On Chip Data RAM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| RAM (words) |
|
64
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
0.4 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MCP7940N-I/MNY with alternatives
Compare MCP7940MT-I/MNY with alternatives