MCR01MZPF8871 vs TSR16GTF8871V feature comparison

MCR01MZPF8871 ROHM Semiconductor

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TSR16GTF8871V Tateyama Kagaku Group

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.35 mm 0.35 mm
Package Length 1 mm 1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.5 mm 0.5 mm
Packing Method TR, Paper, 7 Inch Tape
Rated Power Dissipation (P) 0.063 W 0.063 W
Rated Temperature 70 °C
Resistance 8870 Ω 8870 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0402 0402
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1

Compare MCR01MZPF8871 with alternatives

Compare TSR16GTF8871V with alternatives