MCR03EZHJ162 vs TSR3GJ162V feature comparison

MCR03EZHJ162 ROHM Semiconductor

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TSR3GJ162V Tateyama Kagaku Group

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Samacsys Manufacturer ROHM Semiconductor
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, PAPER, 7 INCH Tape
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C
Resistance 1600 Ω 1600 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1

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Compare TSR3GJ162V with alternatives