MCR03EZHJ912
vs
HCHP0603L9101JB55
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.30
|
8533.21.00.30
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.45 mm
|
0.53 mm
|
| Package Length |
1.6 mm
|
1.68 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.8 mm
|
0.98 mm
|
| Packing Method |
TR, PAPER, 7 INCH
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
0.1 W
|
0.1 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
9100 Ω
|
9100 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0603
|
0603
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
TIN LEAD SILVER OVER NICKEL
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
HIGH PRECISION
|
|
|
|
Compare MCR03EZHJ912 with alternatives
Compare HCHP0603L9101JB55 with alternatives