MD80C52FXXX/B
vs
QD80C51FXXX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MATRA MHS
|
MATRA MHS
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
BOOLEAN PROCESSOR; ROM PROTECT
|
BOOLEAN PROCESSOR; ROM PROTECT
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T40
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
2
|
| Number of I/O Lines |
32
|
32
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Number of Timers |
3
|
2
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
256
|
128
|
| ROM (words) |
8192
|
4096
|
| ROM Programmability |
MROM
|
MROM
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Current-Max |
25 mA
|
20 mA
|
| Supply Voltage-Max |
5.5 V
|
6 V
|
| Supply Voltage-Min |
4.5 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MD80C52FXXX/B with alternatives
Compare QD80C51FXXX with alternatives