MDP1603330RGE04
vs
MDP1603331G
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
Package Description |
DIP, 8525
|
DIP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8533.21.00.60
|
|
Samacsys Manufacturer |
Vishay
|
|
Construction |
Molded Case
|
|
Element Power Dissipation |
0.25 W
|
0.38 W
|
First Element Resistance |
330 Ω
|
330 Ω
|
Lead Length |
3.3 mm
|
|
Lead Spacing |
2.54 mm
|
|
Manufacturer Series |
MDP03
|
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Network Type |
ISOLATED
|
ISOLATED
|
Number of Elements |
1
|
1
|
Number of Functions |
8
|
8
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
3.05 mm
|
|
Package Length |
21.59 mm
|
|
Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Package Style |
DIP
|
|
Package Width |
6.35 mm
|
|
Packing Method |
TUBE
|
TUBE
|
Rated Power Dissipation (P) |
1.92 W
|
3 W
|
Rated Temperature |
70 °C
|
25 °C
|
Resistance |
330 Ω
|
|
Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
Series |
MDP 03
|
|
Size Code |
8525
|
|
Surface Mount |
NO
|
NO
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Temperature Coefficient Tracking |
50 ppm/°C
|
50 ppm/°C
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn/Pb)
|
Terminal Shape |
FLAT
|
FLAT
|
Tolerance |
2%
|
2%
|
Base Number Matches |
2
|
2
|
JESD-609 Code |
|
e0
|
|
|
|
Compare MDP1603330RGE04 with alternatives
Compare MDP1603331G with alternatives