MFRC52201HN1,151
vs
MFRC52201HN1/TRAYB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32
|
5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
SOT617-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-PQCC-N32
|
S-PQCC-N32
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
1
|
2
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MFRC52201HN1,151 with alternatives
Compare MFRC52201HN1/TRAYB with alternatives