MIC2003-1.2YML-TR
vs
MIC2003-1.2YM5-TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVSON, SOLCC6,.08,25
|
LSSOP, TSOP5/6,.11,37
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
7 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-XDSO-N6
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
e4
|
| Length |
2 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSSOP
|
| Package Equivalence Code |
SOLCC6,.08,25
|
TSOP5/6,.11,37
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
1.45 mm
|
| Supply Current-Max (Isup) |
0.3 mA
|
0.3 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
2 mm
|
1.6 mm
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MIC2003-1.2YML-TR with alternatives
Compare MIC2003-1.2YM5-TR with alternatives