MIC5318-3.3YMTTR
vs
MIC5318-3.3YMT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
|
| Package Description |
VSON,
|
HVSON,
|
| Pin Count |
6
|
|
| Manufacturer Package Code |
MLF
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Dropout Voltage1-Max |
0.2 V
|
0.2 V
|
| Input Voltage-Max |
6 V
|
6 V
|
| Input Voltage-Min |
2.3 V
|
2.3 V
|
| JESD-30 Code |
S-PDSO-N6
|
S-XDSO-N6
|
| JESD-609 Code |
e4
|
e4
|
| Length |
1.6 mm
|
1.6 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
3.399 V
|
3.399 V
|
| Output Voltage1-Min |
3.201 V
|
3.201 V
|
| Output Voltage1-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VSON
|
HVSON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.6 mm
|
0.6 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
2
|
3
|
| Voltage Tolerance-Max |
|
3%
|
|
|
|
Compare MIC5318-3.3YMTTR with alternatives
Compare MIC5318-3.3YMT with alternatives