MICRF505LYML-TR
vs
LTC5594IUH#PBF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ANALOG DEVICES INC
|
Package Description |
LEAD FREE, MLF-32
|
QFN-32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
Analog Devices
|
JESD-30 Code |
S-XQCC-N32
|
S-PQCC-N32
|
JESD-609 Code |
e4
|
e3
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
2
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.9 mm
|
0.8 mm
|
Supply Voltage-Nom |
2.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Pin Count |
|
32
|
Manufacturer Package Code |
|
05-08-1693
|
Date Of Intro |
|
2018-01-29
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MICRF505LYML-TR with alternatives
Compare LTC5594IUH#PBF with alternatives