MICRF505LYMLTR
vs
MICRF505YML-TR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DFN
|
|
Package Description |
HVQCCN,
|
LEAD FREE, MLF-32
|
Pin Count |
32
|
|
Manufacturer Package Code |
MLF
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XQCC-N32
|
|
JESD-609 Code |
e4
|
e4
|
Length |
5 mm
|
|
Moisture Sensitivity Level |
2
|
2
|
Number of Functions |
1
|
|
Number of Terminals |
32
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Code |
HVQCCN
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
|
Supply Voltage-Nom |
2.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
5 mm
|
|
Base Number Matches |
2
|
1
|
Factory Lead Time |
|
25 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare MICRF505LYMLTR with alternatives
Compare MICRF505YML-TR with alternatives