MJ15020 vs TIP140T feature comparison

MJ15020 Motorola Mobility LLC

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TIP140T Samsung Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC SAMSUNG SEMICONDUCTOR INC
Package Description FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection COLLECTOR
Collector Current-Max (IC) 4 A 10 A
Collector-Base Capacitance-Max 500 pF
Collector-Emitter Voltage-Max 250 V 60 V
Configuration SINGLE DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 10 500
JEDEC-95 Code TO-204AA
JESD-30 Code O-MBFM-P2 R-PSFM-T3
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 3
Operating Temperature-Max 200 °C 150 °C
Package Body Material METAL PLASTIC/EPOXY
Package Shape ROUND RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 150 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG THROUGH-HOLE
Terminal Position BOTTOM SINGLE
Transistor Application AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 20 MHz
VCEsat-Max 1 V
Base Number Matches 1 1
Part Package Code SFM
Pin Count 3
Power Dissipation-Max (Abs) 80 W

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