MJD44H11-T1 vs MJD44H11T4G feature comparison

MJD44H11-T1 Samsung Semiconductor

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MJD44H11T4G onsemi

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ONSEMI
Package Description SMALL OUTLINE, R-PSSO-G2 DPAK-3
Pin Count 3 3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Collector Current-Max (IC) 8 A 8 A
Collector-Emitter Voltage-Max 80 V 80 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 40 40
JESD-30 Code R-PSSO-G2 R-PSSO-G2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 20 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 50 MHz 85 MHz
VCEsat-Max 1 V
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code DPAK (SINGLE GAUGE) TO-252
Manufacturer Package Code 369C
Factory Lead Time 13 Weeks
Samacsys Manufacturer onsemi
Case Connection COLLECTOR
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 20 W
Terminal Finish Matte Tin (Sn) - annealed
Time@Peak Reflow Temperature-Max (s) 30

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