MKL17Z256VLH4
vs
MKL16Z256VMP4R
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
10 X 10 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, LQFP-64
|
5 X 5 MM, 1.23 MM HEIGHT, 0.50 MM PITCH, MAPBGA-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Clock Frequency-Max |
48 MHz
|
48 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G64
|
S-PBGA-B64
|
| JESD-609 Code |
e3
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
54
|
54
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY
|
| RAM (bytes) |
32768
|
|
| ROM (words) |
262144
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Position |
QUAD
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
|
|
|