ML12009-5P
vs
ML12011EP
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LANSDALE SEMICONDUCTOR INC
|
LANSDALE SEMICONDUCTOR INC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOP,
|
DIP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ECL
|
ECL
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
Length |
9.9 mm
|
19.175 mm
|
Logic IC Type |
PRESCALER
|
PRESCALER
|
Number of Data/Clock Inputs |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
4.44 mm
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
7.62 mm
|
fmax-Min |
480 MHz
|
550 MHz
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ML12009-5P with alternatives
Compare ML12011EP with alternatives