MLG0603S12NJT
vs
BSCQ0006030312NJ00
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TDK CORP
|
PULSE ELECTRONICS CORP
|
| Package Description |
0201
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8504.50.80.00
|
|
| Samacsys Manufacturer |
TDK
|
|
| Case/Size Code |
0201
|
0201
|
| Construction |
Multilayer Chip
|
Rectangular
|
| Core Material |
CERAMIC
|
Ceramic
|
| DC Resistance |
0.9 Ω
|
0.85 Ω
|
| Inductance-Nom (L) |
0.012 µH
|
0.012 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.3 mm
|
0.3 mm
|
| Package Length |
0.6 mm
|
0.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.3 mm
|
0.3 mm
|
| Packing Method |
TR
|
TR, Paper, 7 Inch
|
| Quality Factor-Min (at L-nom) |
6
|
|
| Rated Current-Max |
0.18 A
|
0.23 A
|
| Self Resonance Frequency |
2800 MHz
|
3300 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN OVER NICKEL
|
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
100 MHz
|
500 MHz
|
| Tolerance |
5%
|
5%
|
| Base Number Matches |
3
|
1
|
| Factory Lead Time |
|
22 Weeks
|
|
|
|
Compare MLG0603S12NJT with alternatives
Compare BSCQ0006030312NJ00 with alternatives