MLL3029B-1E3 vs MLL3029B feature comparison

MLL3029B-1E3 Microsemi Corporation

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MLL3029B Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-XELF-R2 HERMETIC SEALED, LEADLESS, GLASS, MELF-2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-XELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1.25 W
Reference Voltage-Nom 24 V 24 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5% 5%
Working Test Current 10.5 mA 10.5 mA
Base Number Matches 1 1
Rohs Code No
Part Package Code DO-213AB
Pin Count 2
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
JESD-609 Code e0
Knee Impedance-Max 750 Ω
Moisture Sensitivity Level 1
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Qualification Status Not Qualified
Reverse Current-Max 10 µA
Terminal Finish TIN LEAD
Voltage Temp Coeff-Max 19.2 mV/°C

Compare MLL3029B-1E3 with alternatives

Compare MLL3029B with alternatives