MLL5519B-1E3 vs MSPMLL5227B-1E3 feature comparison

MLL5519B-1E3 Microsemi Corporation

Buy Now Datasheet

MSPMLL5227B-1E3 Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description SURFACE MOUNT PACKAGE-2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, MLL34, MELF-2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-XELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 3.6 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 1 2
Rohs Code Yes
Part Package Code DO-213AA
Pin Count 2
JESD-609 Code e3
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Qualification Status Not Qualified
Reference Standard MIL-19500
Terminal Finish MATTE TIN

Compare MLL5519B-1E3 with alternatives

Compare MSPMLL5227B-1E3 with alternatives