MLXV3824A-1
vs
CH3824-37
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
DO-213AB
|
|
| Package Description |
O-XELF-R2
|
R-XUUC-N1
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-213AB
|
|
| JESD-30 Code |
O-XELF-R2
|
R-XUUC-N1
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
4.3 V
|
4.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
NO LEAD
|
| Terminal Position |
END
|
UPPER
|
| Voltage Tol-Max |
5%
|
10%
|
| Working Test Current |
58 mA
|
58 mA
|
| Base Number Matches |
2
|
2
|
| Knee Impedance-Max |
|
400 Ω
|
| Reverse Current-Max |
|
10 µA
|
| Voltage Temp Coeff-Max |
|
|
|
|
|
Compare MLXV3824A-1 with alternatives
Compare CH3824-37 with alternatives