MM74HC00MX vs HD74HC00FP feature comparison

MM74HC00MX National Semiconductor Corporation

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HD74HC00FP Hitachi Ltd

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP HITACHI LTD
Package Description PLASTIC, SO-14 SOP, SOP14,.3
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 23 ns 115 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.5 mm
Base Number Matches 5 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 20

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