MM74HC00NX
vs
TC74HC00APF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ON SEMICONDUCTOR
TOSHIBA CORP
Package Description
DIP,
0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
113 ns
95 ns
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
Samacsys Manufacturer
Toshiba
Length
19.25 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
19 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
4.45 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare MM74HC00NX with alternatives
Compare TC74HC00APF with alternatives