MM74HCT00MX vs HD74HC132P feature comparison

MM74HCT00MX National Semiconductor Corporation

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HD74HC132P Hitachi Ltd

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP HITACHI LTD
Package Description PLASTIC, SO-14 DIP, DIP14,.3
Reach Compliance Code unknown unknown
kg CO2e/kg 12.4 12.4
Average Weight (mg) 151.15 1630.6
CO2e (mg) 1874.26 20219.441
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 19.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 29 ns 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.06 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 5 2
Rohs Code Yes
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TR
Prop. Delay@Nom-Sup 25 ns
Schmitt Trigger YES

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