MMBD4448HSDW
vs
MMBD4448HSDW-H
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
|
FORMOSA MICROSEMI CO LTD
|
| Part Package Code |
SOT-363
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Configuration |
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-F6
|
R-PDSO-G6
|
| Number of Elements |
4
|
4
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Output Current-Max |
0.25 A
|
0.25 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Dissipation-Max |
0.2 W
|
0.2 W
|
| Rep Pk Reverse Voltage-Max |
80 V
|
80 V
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
R-PDSO-G6
|
|
|
|
Compare MMBD4448HSDW with alternatives
Compare MMBD4448HSDW-H with alternatives