MMBD6050-E3-08
vs
MMBD6050LT3G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
ONSEMI
|
| Package Description |
ROHS COMPLIANT PACKAGE-3
|
TO-236, 3 PIN
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Factory Lead Time |
12 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Vishay
|
onsemi
|
| Case Connection |
UNSPECIFIED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
0.5 A
|
0.5 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Power Dissipation-Max |
0.225 W
|
0.225 W
|
| Rep Pk Reverse Voltage-Max |
70 V
|
70 V
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOT-23 (TO-236) 3 LEAD
|
| Manufacturer Package Code |
|
318-08
|
| Forward Voltage-Max (VF) |
|
1.1 V
|
| JEDEC-95 Code |
|
TO-236AB
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MMBD6050-E3-08 with alternatives
Compare MMBD6050LT3G with alternatives