MMBD7000LT3G
vs
SMMBD7000LT3G
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
ONSEMI
|
SILICON360
|
Part Package Code |
SOT-23 (TO-236) 3 LEAD
|
|
Package Description |
CASE 318-08, 3 PIN
|
HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
|
Pin Count |
3
|
3
|
Manufacturer Package Code |
318-08
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Factory Lead Time |
10 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Application |
GENERAL PURPOSE
|
|
Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
JEDEC-95 Code |
TO-236AB
|
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
1.6 A
|
|
Number of Elements |
2
|
2
|
Number of Phases |
1
|
|
Number of Terminals |
3
|
3
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
0.2 A
|
0.2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Power Dissipation-Max |
0.225 W
|
0.225 W
|
Qualification Status |
Not Qualified
|
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Operating Temperature-Max |
|
150 °C
|
Reference Standard |
|
AEC-Q101
|
|
|
|
Compare MMBD7000LT3G with alternatives
Compare SMMBD7000LT3G with alternatives