MMBF170LT3
vs
MMBF170LT1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ON SEMICONDUCTOR
Package Description
SMALL OUTLINE, R-PDSO-G3
TO-236, CASE 318-08, 3 PIN
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.21.00.95
8541.21.00.95
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
60 V
60 V
Drain Current-Max (ID)
0.5 A
0.5 A
Drain-source On Resistance-Max
5 Ω
5 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code
TO-236AB
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation Ambient-Max
0.225 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
4
Pbfree Code
Part Package Code
SOT-23 (TO-236) 3 LEAD
Pin Count
3
Manufacturer Package Code
318
Samacsys Manufacturer
onsemi
JESD-609 Code
e0
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
235
Power Dissipation-Max (Abs)
0.225 W
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Compare MMBF170LT3 with alternatives
Compare MMBF170LT1 with alternatives