MMBFJ112
vs
TIS74
feature comparison
Pbfree Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ONSEMI
|
SOLITRON DEVICES INC
|
Manufacturer Package Code |
318-08
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
onsemi
|
|
Configuration |
SINGLE
|
SINGLE
|
Drain-source On Resistance-Max |
50 Ω
|
100 Ω
|
FET Technology |
JUNCTION
|
JUNCTION
|
Feedback Cap-Max (Crss) |
5 pF
|
4 pF
|
JESD-30 Code |
R-PDSO-G3
|
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
2
|
Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
0.35 W
|
0.36 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
GULL WING
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
DIE
|
Package Description |
|
0.018 X 0.023 INCH, DIE-2
|
Pin Count |
|
2
|
|
|
|
Compare MMBFJ112 with alternatives
Compare TIS74 with alternatives