MMBFJ175LT1G
vs
MMBFJ175LT3
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
| Part Package Code |
SOT-23 (TO-236) 3 LEAD
|
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN
|
SMALL OUTLINE, R-PDSO-G3
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
318-08
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.21.00.95
|
8541.21.00.95
|
| Factory Lead Time |
4 Weeks
|
|
| Date Of Intro |
1994-05-01
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| Drain Current-Max (ID) |
0.06 A
|
|
| Drain-source On Resistance-Max |
125 Ω
|
125 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
JUNCTION
|
| Feedback Cap-Max (Crss) |
5.5 pF
|
5.5 pF
|
| JEDEC-95 Code |
TO-236
|
TO-236AB
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
| Power Dissipation Ambient-Max |
0.225 W
|
0.225 W
|
| Power Dissipation-Max (Abs) |
0.225 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
CHOPPER
|
CHOPPER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MMBFJ175LT1G with alternatives
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