MMPF0100NPAEP
vs
MMPF0100NPEP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
QFN-56
|
8 X 8 MM, 0.85 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, QFN-56
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
16 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
INTEGRATED POWER MANAGEMENT UNIT
|
INTEGRATED POWER MANAGEMENT UNIT
|
| JESD-30 Code |
S-XQCC-N56
|
S-XQCC-N56
|
| JESD-609 Code |
e4
|
e3
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Silver (Ag)
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
56
|
| Package Equivalence Code |
|
LCC56,.31SQ,20
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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