MMSZ5254B
vs
TCBZV55C30
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
|
| Reach Compliance Code |
compliant
|
compliant
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
R-PDSO-G2
|
O-LELF-R2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
27 V
|
30 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
GULL WING
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Voltage Tol-Max |
5%
|
6.67%
|
| Working Test Current |
4.6 mA
|
5 mA
|
| Base Number Matches |
5
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-213AC
|
| Package Description |
|
O-LELF-R2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Case Connection |
|
ISOLATED
|
| Dynamic Impedance-Max |
|
80 Ω
|
| JEDEC-95 Code |
|
DO-213AC
|
| JESD-609 Code |
|
e3
|
| Operating Temperature-Max |
|
175 °C
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare MMSZ5254B with alternatives
Compare TCBZV55C30 with alternatives