MPC2003SG50
vs
MCM72MS64SG66
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Package Description |
DIMM-136
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
14 ns
|
9 ns
|
Additional Feature |
BYTE WRITE; BURST COUNTER; SELF-TIMED WRITE
|
BYTE WRITE; SELF-TIMED WRITE; BURST COUNTER
|
Alternate Memory Width |
72
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-XDMA-N136
|
R-XDMA-N136
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
CACHE SRAM MODULE
|
CACHE SRAM MODULE
|
Memory Width |
36
|
72
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
136
|
136
|
Number of Words |
131072 words
|
65536 words
|
Number of Words Code |
128000
|
64000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
128KX36
|
64KX72
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
YES
|
YES
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
|
Package Equivalence Code |
DIMM136
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.3 A
|
|
Standby Voltage-Min |
4.75 V
|
|
Supply Current-Max |
1 mA
|
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC2003SG50 with alternatives
Compare MCM72MS64SG66 with alternatives