MPC509
vs
MPC555LFAZP40
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Package Description |
QFP,
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
YES
|
Address Bus Width |
30
|
24
|
Bit Size |
32
|
32
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PQFP-G16
|
S-PBGA-B272
|
Length |
28 mm
|
27 mm
|
Number of I/O Lines |
58
|
101
|
Number of Terminals |
16
|
272
|
PWM Channels |
NO
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.85 mm
|
2.65 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
272
|
ECCN Code |
|
3A001.A.2.C
|
Additional Feature |
|
ALSO REQUIRES 5V SUPPLY
|
Boundary Scan |
|
YES
|
CPU Family |
|
MPC500
|
Clock Frequency-Max |
|
20 MHz
|
Format |
|
FLOATING POINT
|
Low Power Mode |
|
YES
|
Number of DMA Channels |
|
|
Number of Serial I/Os |
|
4
|
Number of Timers |
|
3
|
On Chip Data RAM Width |
|
8
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Equivalence Code |
|
BGA272,20X20,50
|
RAM (bytes) |
|
26624
|
ROM (words) |
|
458752
|
ROM Programmability |
|
FLASH
|
Speed |
|
40 MHz
|
Supply Voltage-Max |
|
3.6 V
|
Supply Voltage-Min |
|
3 V
|
Temperature Grade |
|
MILITARY
|
|
|
|
Compare MPC509 with alternatives
Compare MPC555LFAZP40 with alternatives