MPC509 vs MPC555LFAZP40 feature comparison

MPC509 Motorola Mobility LLC

Buy Now Datasheet

MPC555LFAZP40 Motorola Mobility LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Package Description QFP, BGA,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO YES
Address Bus Width 30 24
Bit Size 32 32
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PQFP-G16 S-PBGA-B272
Length 28 mm 27 mm
Number of I/O Lines 58 101
Number of Terminals 16 272
PWM Channels NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.85 mm 2.65 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS HCMOS
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 28 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 272
ECCN Code 3A001.A.2.C
Additional Feature ALSO REQUIRES 5V SUPPLY
Boundary Scan YES
CPU Family MPC500
Clock Frequency-Max 20 MHz
Format FLOATING POINT
Low Power Mode YES
Number of DMA Channels
Number of Serial I/Os 4
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Equivalence Code BGA272,20X20,50
RAM (bytes) 26624
ROM (words) 458752
ROM Programmability FLASH
Speed 40 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Temperature Grade MILITARY

Compare MPC509 with alternatives

Compare MPC555LFAZP40 with alternatives