MPC509 vs MPC563CZP40 feature comparison

MPC509 Motorola Mobility LLC

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MPC563CZP40 Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Package Description QFP, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 30 24
Bit Size 32 32
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PQFP-G16 S-PBGA-B388
Length 28 mm 27 mm
Number of I/O Lines 58 16
Number of Terminals 16 388
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.85 mm 2.55 mm
Supply Voltage-Nom 3.3 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1 mm
Terminal Position QUAD BOTTOM
Width 28 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 388
ECCN Code 3A991.A.2
Samacsys Manufacturer NXP
Clock Frequency-Max 20 MHz
JESD-609 Code e0
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA388,26X26,40
Peak Reflow Temperature (Cel) 240
RAM (bytes) 32768
ROM (words) 524288
ROM Programmability FLASH
Speed 40 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead/Silver (Sn62Pb36Ag2)
Time@Peak Reflow Temperature-Max (s) 30

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Compare MPC563CZP40 with alternatives